Weight reduction is a key
issue in aerospace/aircraft applications. One should never neglect any possible
opportunity to reduce weight. Accumulation of the weight reduction of every
individual component may lead to a down-sized engine or smaller wings. A rule
of thumb in aerospace field is that one pound directly saved weight can lead to
another pound reduction indirectly. The smaller the take-off weight, the
smaller the amount of fuel needed, which brings a lot of economical and
ecological benefits. In military applications like submarines where mobility is
a big concern, weight cut is also crucial.
A big weight reduction potential
lies in utilizing lighter heat sinks in electronic devices used in aerospace/aircraft
applications and submarines. MoCu heat sinks provided by Torrey HillsTechnologies have been applied in the International Space Station (ISS), F-15
Eagle fighters and submarines to provide the solutions.
Fig 1. ISS
Fig 2. A submarine
Fig 3.An air fighter
Challenge
How to reduce the weight of heat
sinks in electronic devices while meeting other performance requirements like
CTE (coefficient of thermal expansion) and TC (thermal conductivity) has been a
challenge in aerospace and military application fields.
Solutions: MoCu thermal
management materials
The MoCu composite exhibits
combinational properties such as high electrical and thermal conductivities,
low CTE, nonmagnetic, good high-temperature performance and etc.
Compared with traditional
packaging materials, they have a high thermal conductivity and their CTEs can
be tailored by adjusting the Mo/Cu ratio to closely match those of die
materials.
Compared with WCu materials
which also enjoy high thermal conductivity and are CTE changeable, MoCu
materials have a lower density. Typical properties of heat sink grade WCu and
MoCu materials are shown respectively in table 1 and table 2.
Table 1 Typical properties of heat sink grade
WCu
|
Name
|
Density(g/cm3)
|
CTE(10-6K-1)
|
TC(W/mK)
|
|
W90Cu
W88Cu
W85Cu
W80Cu
|
17.0
16.9
16.3
15.6
|
6.5
6.8
7.0
8.0
|
190-200
190-200
200-210
210-220
|
Table 2 Typical properties of heat sink grade MoCu
|
Name
|
Density(g/cm3)
|
CTE(10-6K-1)
|
TC(W/mK)
|
|
Mo85Cu
Mo80Cu
Mo70Cu
Mo60Cu
Mo50Cu
|
10.0
9.9
9.7
9.6
9.5
|
6.8
7.2
7.5
9.5
9.9
|
165
175
195
215
250
|
For
more information, please check http://www.torreyhillstech.com/hsmocu.html
